300-032-050Description Description_300-032-050Specifications

Sockets for ICs Transistors

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Specifications

Description	Details
Series	300
Package	-
Type	SIP
Number of Positions or Pins (Grid)	32 (1 x 32)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	8.00µin (0.203µm)
Contact Material - Mating	-
Mounting Type	Through Hole
Features	Closed Frame
Termination	-
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	8.00µin (0.203µm)
Contact Material - Post	-
Housing Material	-
Operating Temperature	-

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