SIP1X08-014BLFDescription Description_SIP1X08-014BLFSpecifications

Sockets for ICs Transistors

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Specifications

Description	Details
Series	SIP1x
Package	Bulk
Type	SIP
Number of Positions or Pins (Grid)	8 (1 x 8)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Tin
Contact Finish Thickness - Mating	150.0µin (3.81µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Brass
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature	-

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Price advantage, SIP1X08-014BLF is available in stock and can be delivered on the same day

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