MS05Description Description_MS05Specifications_Apex Microtechnology-www.samsong.com

Sockets for ICs Transistors

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Specifications

Description	Details
Series	Apex Precision Power®
Package	Bulk
Type	DIP, 1.2" (30.48mm) Row Spacing
Number of Positions or Pins (Grid)	12 (2 x 6)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Brass
Housing Material	Polyester, Glass Filled
Operating Temperature	-

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