225-PLS18003-12Description Description_225-PLS18003-12Specifications

Sockets for ICs Transistors

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In Stock：17,288(Ref. price)

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1	$94.72680	$94.72680

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Specifications

Description	Details
Series	PLS
Package	-
Type	PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)	225 (15 x 15)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS)
Operating Temperature	-

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Price advantage, 225-PLS18003-12 is available in stock and can be delivered on the same day

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