28-6570-16Description Description_28-6570-16Specifications

Sockets for ICs Transistors

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In Stock：17,974(Ref. price)

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Specifications

Description	Details
Series	57
Package	Bulk
Type	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)	28 (2 x 14)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Nickel Boron
Contact Finish Thickness - Mating	50.0µin (1.27µm)
Contact Material - Mating	Beryllium Nickel
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Nickel Boron
Contact Finish Thickness - Post	50.0µin (1.27µm)
Contact Material - Post	Beryllium Nickel
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature	-

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