8-1437529-1Description Description_8-1437529-1Specifications_TE Connectivity AMP Connectors-www.samsong.com

Sockets for ICs Transistors

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Specifications

Description	Details
Series	500
Package	Bulk
Type	DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid)	8 (2 x 4)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	20.0µin (0.51µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	47.2µin (1.20µm)
Contact Material - Post	Copper Alloy
Housing Material	Thermoplastic, Polyester
Operating Temperature	-55°C ~ 105°C

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