24-8370-610CDescription Description_24-8370-610CSpecifications

Sockets for ICs Transistors

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In Stock：17,022(Ref. price)

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Specifications

Description	Details
Series	8
Package	Bulk
Type	DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)	24 (2 x 12)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame, Elevated
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-55°C ~ 105°C

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Price advantage, 24-8370-610C is available in stock and can be delivered on the same day

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