100-008-001Description Description_100-008-001Specifications

Sockets for ICs Transistors

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Specifications

Description	Details
Series	100
Package	Bulk
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	8 (2 x 4)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	8.00µin (0.203µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame, Seal Tape
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	Flash
Contact Material - Post	Brass
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature	-65°C ~ 125°C

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Price advantage, 100-008-001 is available in stock and can be delivered on the same day

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