550-10-256M20-001166Description Description_550-10-256M20-001166Specifications

Sockets for ICs Transistors

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In Stock：19,322(Ref. price)

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Specifications

Description	Details
Series	550
Package	Bulk
Type	BGA
Number of Positions or Pins (Grid)	256 (20 x 20)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass
Housing Material	FR4 Epoxy Glass
Operating Temperature	-55°C ~ 125°C

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Price advantage, 550-10-256M20-001166 is available in stock and can be delivered on the same day

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