1735315-4Description Description_1735315-4Specifications_TE Connectivity AMP Connectors-www.samsong.com

Sockets for ICs Transistors

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Specifications

Description	Details
Series	-
Package	Tray
Type	PGA, ZIF (ZIP)
Number of Positions or Pins (Grid)	939 (31 x 31)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	15.0µin (0.38µm)
Contact Material - Mating	Copper Alloy
Mounting Type	Surface Mount
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	15.0µin (0.38µm)
Contact Material - Post	Copper Alloy
Housing Material	Thermoplastic
Operating Temperature	-

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