558-10-360M19-001104Description Description_558-10-360M19-001104Specifications

Sockets for ICs Transistors

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In Stock：20,562(Ref. price)

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Specifications

Description	Details
Series	558
Package	Bulk
Type	BGA
Number of Positions or Pins (Grid)	360 (19 x 19)
Pitch - Mating	0.050" (1.27mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Brass
Mounting Type	Surface Mount
Features	Closed Frame
Termination	Solder
Pitch - Post	0.050" (1.27mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Material - Post	Brass
Housing Material	FR4 Epoxy Glass
Operating Temperature	-55°C ~ 125°C

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Price advantage, 558-10-360M19-001104 is available in stock and can be delivered on the same day

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