TG-NSP50-4OZDescription Description_TG-NSP50-4OZSpecifications

Thermal - Adhesives、 Epoxies

The picture is for reference only

Please fill in the inquiry information for purchasing and consulting products

PartName*	Quantity*	Batch Number	Package	Manufacturer	Other requirements

Please fill in the contact details and reply to you in 3 minutes

In Stock：657(Ref. price)

Qty.	Unit Price	Ext. Price
1	$51.44040	$51.44040

Qty：

Add inquiry Quick quote

Related products

Documents

Specifications

Description	Details
Series	TG-NSP50
Package	Bulk
Type	Non-Silicone Putty
Size / Dimension	4 oz Tube
Usable Temperature Range	-40°F ~ 392°F (-40°C ~ 200°C)
Color	Gray
Thermal Conductivity	5.40W/m-K
Features	-
Shelf Life	60 Months
Storage/Refrigeration Temperature	-

Other

Price advantage, TG-NSP50-4OZ is available in stock and can be delivered on the same day

Recommended Product

Part No	Manufacturer	Product Category	Datasheet	Description	Reference price	Quantity
860-60G	MG Chemicals	Thermal - Adhesives、 Epoxies	Datasheet	HEAT TRANS COMPOUND SILICONE	$11.49148	In Stock:17120
TC1-10G	Chip Quik Inc.	Thermal - Adhesives、 Epoxies	Datasheet	HEAT SINK COMPOUND - HIGH DENSIT	$8.86050	In Stock:349
A17170-03	Laird Technologies - Thermal Materials	Thermal - Adhesives、 Epoxies	Datasheet	TPUTTY 508 360CC EFD CARTRIDGE	$157.77546	In Stock:17126
A13717-01	Laird Technologies - Thermal Materials	Thermal - Adhesives、 Epoxies	Datasheet	TPUTTY 504 10CC SYRINGE MANUAL	No price	In Stock:17130
152-KA-NC	Wakefield-Vette	Thermal - Adhesives、 Epoxies	Datasheet	DELTABOND KIT (7 OZ RESIN, 0.5 O	$83.58860	In Stock:17132