HP3-TO3-CBDescription Description_HP3-TO3-CBSpecifications_CTS Thermal Management Products-www.samsong.com

Thermal - Heat Sinks

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Specifications

Description	Details
Series	HP3
Package	-
Type	Board Level
Package Cooled	TO-3
Attachment Method	Bolt On
Shape	Square, Pin Fins
Length	3.120" (79.25mm)
Width	3.120" (79.25mm)
Diameter	-
Fin Height	1.000" (25.40mm)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	-
Thermal Resistance @ Natural	4.40°C/W
Material	Aluminum
Material Finish	Black Anodized

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