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Thermal - Heat Sinks
BDN11-3CB/A01 Picture

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BDN11-3CB/A01

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In Stock:6,322(Ref. price)
Qty.Unit PriceExt. Price
1
$2.50880
$2.50880
Documents
Specifications
DescriptionDetails
Series
BDN
Package
Box
Type
Top Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Included)
Shape
Square, Pin Fins
Length
1.110" (28.19mm)
Width
1.110" (28.19mm)
Diameter
-
Fin Height
0.355" (9.02mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
7.20°C/W @ 400 LFM
Thermal Resistance @ Natural
20.90°C/W
Material
Aluminum
Material Finish
Black Anodized
Other
Price advantage, BDN11-3CB/A01 is available in stock and can be delivered on the same day
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