R7F701406EABG-C#HC1Description Description_R7F701406EABG-C#HC1Specifications_Renesas Electronics America Inc-www.samsong.com

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Specifications

Description	Details
Series	RH850/D1x
Package	Tray
Core Processor	RH850G3M
Core Size	32-Bit
Speed	200MHz
Connectivity	CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals	DMA, PWM, WDT
Number of I/O	126
Program Memory Size	3.75MB (3.75M x 8)
Program Memory Type	FLASH
EEPROM Size	64K x 8
RAM Size	512K x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V
Data Converters	A/D 16x12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 150°C (TJ)
Mounting Type	Surface Mount
Package / Case	272-BGA
Supplier Device Package	272-BGA (21x21)

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