R5F572MNDDBG#20Description Description_R5F572MNDDBG#20Specifications_Renesas Electronics America Inc-www.samsong.com

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In Stock：3,508(Ref. price)

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Specifications

Description	Details
Series	RX700
Package	Tray
Core Processor	RXv3
Core Size	32-Bit
Speed	240MHz
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
Peripherals	DMA, LCD, LVD, POR, PWM, WDT
Number of I/O	136
Program Memory Size	4MB (4M x 8)
Program Memory Type	FLASH
EEPROM Size	32K x 8
RAM Size	1M x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 3.6V
Data Converters	A/D 8x12b, 21x12b; D/A 2x12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	176-LFBGA
Supplier Device Package	176-LFBGA (13x13)

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