R7F7010574AFP#AA3Description Description_R7F7010574AFP#AA3Specifications_Renesas Electronics America Inc-www.samsong.com

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Specifications

Description	Details
Series	RH850/F1x
Package	Tray
Core Processor	RH850G3K
Core Size	32-Bit
Speed	80MHz
Connectivity	CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals	DMA, PWM, WDT
Number of I/O	150
Program Memory Size	2MB (2M x 8)
Program Memory Type	FLASH
EEPROM Size	64K x 8
RAM Size	192K x 8
Voltage - Supply (Vcc/Vdd)	3V ~ 5.5V
Data Converters	A/D 28x10b, 32x12b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 105°C (TA)
Mounting Type	Surface Mount
Package / Case	176-LQFP
Supplier Device Package	176-LFQFP (24x24)

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