UPD70F3824GB-GAH-AXDescription Description_UPD70F3824GB-GAH-AXSpecifications_Renesas Electronics America Inc-www.samsong.com

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Specifications

Description	Details
Series	V850ES/Jx3-H
Package	Tray
Core Processor	V850ES
Core Size	32-Bit
Speed	48MHz
Connectivity	CANbus, CSI, EBI/EMI, I²C, UART/USART, USB
Peripherals	DMA, LVD, PWM, WDT
Number of I/O	45
Program Memory Size	256KB (256K x 8)
Program Memory Type	FLASH
EEPROM Size	-
RAM Size	24K x 8
Voltage - Supply (Vcc/Vdd)	2.85V ~ 3.6V
Data Converters	A/D 10x10b; D/A 1x8b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	64-LQFP
Supplier Device Package	-

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