R8A774C0HA01BG#U0Description Description_R8A774C0HA01BG#U0Specifications_Renesas Electronics America Inc-www.samsong.com

Microprocessors

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Specifications

Description	Details
Series	RZ/G2E
Package	Tray
Core Processor	ARM® Cortex®-A53
Number of Cores/Bus Width	2 Core, 64-Bit
Speed	1.2GHz
Co-Processors/DSP	Multimedia; NEON™ MPE
RAM Controllers	DDR3L
Graphics Acceleration	No
Display & Interface Controllers	MIPI-CSI
Ethernet	10/100Mbps (1), 100/1000Mbps (1)
SATA	-
USB	USB 2.0 (1), USB 3.0 (1)
Voltage - I/O	-
Operating Temperature	-40°C ~ 85°C (TA)
Security Features	-
Package / Case	552-FBGA
Supplier Device Package	552-FBGA (21x21)

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