XA7Z030-1FBG484QDescription Description_XA7Z030-1FBG484QSpecifications

System On Chip (SoC)

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Specifications

Description	Details
Series	Automotive, AEC-Q100, Zynq®-7000 XA
Package	Tray
Architecture	MCU, FPGA
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size	-
RAM Size	256KB
Peripherals	DMA
Connectivity	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed	667MHz
Primary Attributes	Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature	-40°C ~ 125°C (TJ)
Package / Case	484-BBGA, FCBGA
Supplier Device Package	484-FCBGA (23x23)

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