110020049Description Description_110020049Specifications_Seeed Technology Co., Ltd-www.samsong.com

Educational Kits

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Specifications

Description	Details
Series	Wio
Package	Bulk
Kit Type	Starter Kit
Main Purpose	IoT Kit
Interconnect System	Grove
Suggested Programming Environment	Wio Link App
Utilized IC / Part	ESP8266
Included MCU/MPU Board(s)	Wio Link

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