OS-S031Description Description_OS-S031Specifications

Solder

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Specifications

Description	Details
Series	-
Package	-
Type	Wire Solder
Composition	Sn63Pb37 (63/37)
Diameter	0.031" (0.79mm)
Melting Point	361°F (183°C)
Flux Type	No-Clean
Wire Gauge	20 AWG, 22 SWG
Process	Leaded
Form	Spool
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	-

Other

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