386825Description Description_386825Specifications

Solder

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Specifications

Description	Details
Series	C400
Package	Spool
Type	Wire Solder
Composition	Sn63Pb37 (63/37)
Diameter	0.032" (0.81mm)
Melting Point	361°F (183°C)
Flux Type	No-Clean
Wire Gauge	20 AWG, 21 SWG
Process	Leaded
Form	Spool, 1 lb (454 g)
Shelf Life	-
Shelf Life Start	-
Storage/Refrigeration Temperature	-

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