70-1709-0820Description Description_70-1709-0820Specifications

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Specifications

Description	Details
Series	R500
Package	Bulk
Type	Solder Paste
Composition	Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
Diameter	-
Melting Point	423 ~ 424°F (217 ~ 218°C)
Flux Type	Water Soluble
Wire Gauge	-
Process	Lead Free
Form	Syringe, 1.23 oz (35g), 10cc
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	32°F ~ 50°F (0°C ~ 10°C)

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